Flexible circuit materials
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Polyimide Metallization Using Nickel Nano-Film as both Catalyst and Barrier Layer of Copper Electroless Deposition;Journal of The Electrochemical Society;2019
2. Comparison of thermal decomposition and chemical reduction of particle-free silver ink for inkjet printing;Thin Solid Films;2017-08
3. Study of Surface Metallization of Polyimide Film and Interfacial Characterization;Metals;2017-05-25
4. Silver Metallization of Polyimide Surfaces Using Environmentally Friendly Reducing Agents;ECS Electrochemistry Letters;2013-08-14
5. Disposal of waste computer hard disk drive: data destruction and resources recycling;Waste Management & Research: The Journal for a Sustainable Circular Economy;2013-03-22
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