Study of Surface Metallization of Polyimide Film and Interfacial Characterization
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/7/6/189/pdf
Reference36 articles.
1. Modification of Cu nanoparticles with a disulfide for polyimide metallization
2. Effect of annealing on the interfacial adhesion energy between electroless-plated Ni and polyimide
3. Effect of PI film surface on printing of Pd(II) catalytic ink for electroless copper plating in the printed electronics
4. Silver Metallization of Polyimide Surfaces Using Environmentally Friendly Reducing Agents
5. Low-cost microelectrode array with integrated heater for extracellular recording of cardiomyocyte cultures using commercial flexible printed circuit technology
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