1. Azar, K. and Dino, J.F. (1997), “Measuring chip temperatures with thermochromic liquid crystals”, Electronics Cooling, Vol. 3 No. 1.
2. Achieving accurate thermal characterization using a CFD code-case study of plastic packages
3. John, S. (1997), “Electrical temperature measurement using semiconductors”, Electronics Cooling, Vol. 3 No. 1.
4. Sarang, S. and Tien‐Yu, T.L. (1999), “A comparative study of the performance of compact model topologies and their implementation in CFD for a plastic ball grid array package”, Advances in Electronic Packaging, Vol. 26 No. 1, pp. 97‐104.