Achieving accurate thermal characterization using a CFD code-case study of plastic packages
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/95/10163/00477458.pdf?arnumber=477458
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Numerical Investigation of Heat Transfer of Twelve Plastic Leaded Chip Carrier (PLCC) by Using Computational Fluid Dynamic, FLUENTTM Software;Advanced Materials Research;2013-09
4. The Comparison between Four PLCC Packages and Eight PLCC Packages in Personal Computer (PC) Using Computational Fluid Dynamic (CFD), FLUENT SoftwareTM Using Epoxy Moulding Compound Material (EMC);Advanced Materials Research;2013-09
5. A New Invention of Thermal Pad Using Sol-Gel Nanosilver Doped Silica Film in Plastic Leaded Chip Carrier (PLCC) Application by Using Computational Fluid Dynamic Sofrware, CFD Analysis;Advanced Materials Research;2013-09
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