1. Seeded region growing
2. Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers
3. Flaw detection of cylindrical surfaces in PU-packing by using machine vision technique
4. Coletti, G., Tool, C.J.J. and Geerligs, L.J. (2005), “Mechanical strength of silicon wafers and its modeling”,15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, CO, USA, August 7‐10, pp. 117‐20.
5. Connor, Z.M., Fine, M.E., Achenbach, J.D. and Seniw, M.E. (1998), “Using scanning acoustic microscopy to study subsurface defects and crack propagation in materials”,Journal of Microscopy, Vol. 50 No. 11.