Thermal fatigue cracking of surface mount conductive adhesive joints-Reference-Cited by-同舟云学术

Thermal fatigue cracking of surface mount conductive adhesive joints

Published:2004-04 Issue:1 Volume:16 Page:48-52
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Mo Zhimin,Lai Zonghe,Li Shiming,Liu Johan

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Akay, H.U., Paydar, N.H., Zhang, H. and Glogas, G. (1998), “Viscoelastic study of a conductive adhesive for electronic packages. Part 2: thermal stress analysis using the finite element method”,International Journal of Microelectronic Packaging Materials and Technologies, Vol. 1 No. 3, pp. 225‐33.

2. Botter, H., Van Der Plas, R.B. and Arunjunai, A. (1998), “Factors that influence the electrical contact resistance of isotropic conductive adhesive joints during climate chamber testing”,International Journal of Microelectronic Packaging Materials and Technologies, Vol. 1 No. 3, pp. 177‐85.

3. The Effective Use of Rubbers as Toughening Agents for Plastics

4. Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

5. Assembly with Conductive Adhesives

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