Life Cycle Assessment of Japanese High-Temperature Conductive Adhesives-Reference-Cited by-同舟云学术

Life Cycle Assessment of Japanese High-Temperature Conductive Adhesives

Published:2008-03-12 Issue:8 Volume:42 Page:3084-3089
ISSN:0013-936X
Container-title:Environmental Science & Technology
language:en
Short-container-title:Environ. Sci. Technol.

Author:

Andrae Anders S. G.¹,Itsubo Norihiro¹,Yamaguchi Hiroshi¹,Inaba Atsushi¹

Affiliation:

1. Research Center for Life Cycle Assessment, National Institute of Advanced Industrial Science and Technology (AIST), 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan, and Faculty of Environmental and Information Studies, Musashi Institute of Technology, 3-3-1 Ushikubo-Nishi, Tsuzuki-ku, Yokohama, Kanagawa, Japan

Publisher

American Chemical Society (ACS)

Subject

Environmental Chemistry,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/es0709829

Reference41 articles.

1. Mechanical properties of nanostructured polymer particles for anisotropic conductive adhesives

2. Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

3. Electronics Without Lead

4. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

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