Solder paste characterisation: towards the development of quality control (QC) tool-Reference-Cited by-同舟云学术

Solder paste characterisation: towards the development of quality control (QC) tool

Published:2008-06-27 Issue:3 Volume:20 Page:34-40
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Durairaj R.,Mallik S.,Ekere N.N.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Engineering solder paste performance through controlled stress rheology analysis

2. Costello, B. (1997), “The use of creep tests after pre‐shear to predict the sagging and slumping properties of multicore solders”, Thermal Analysis and Rheology, TA Instruments, June.

3. Rheology of non-Newtonian fluids: A new flow equation for pseudoplastic systems

4. Process Modelling Maps for Solder Paste Printing

5. PARAMETER INTERACTIONS IN STENCIL PRINTING OF SOLDER PASTE

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