Author:
Illés Balázs,Krammer Olivér,Géczy Attila
Reference65 articles.
1. N.-C. Lee, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, Newnes, 2002.
2. G. Harsányi, Elektronikai Technológia és Anyagismeret, University Lecture Notes, BME-ETT, 2019, ISBN: 978-963-421-791-6.
3. Effect of solder joint arrangements on BGA lead-free reliability during cooling stage of reflow soldering process;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2012
4. Influence of process parameters on SAC305 lead-free solder powder produced by centrifugal atomization;Plookphol;Powder Technol.,2011
5. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition;Yusoff;Solder. Surf. Mt. Technol.,2019
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献