A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment-Reference-Cited by-同舟云学术

A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment

Published:2008-06-27 Issue:3 Volume:20 Page:26-33
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Greene Christopher M.,Srihari Krishnaswami

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. Abtew, M. and Selvaduray, G. (1998), “Lead‐free solders for surface mount technology applications”,Chip Scale Review, Vol. 2 No. 4, pp. 29‐38.

2. Bastecki, C. (1997), “Lead‐free assembly of mixed‐technology PCBs”,Surface Mount Technology, Vol. 11 No. 5, pp. 52‐8.

3. Gopalakrishnan, L. and Srihari, K. (1998), “Process planning for area array component assembly”,Proceedings – 8th International Conference on Flexible Automation and Intelligent Manufacturing, Portland, Oregon, July, pp. 321‐32.

4. Greene, C.M., Srihari, K. and DiLella, J. (2000), “Optimizing the stencil printing of lead free pastes using designed experiments”,Proceedings of the SMTA Symposium on Lead Free Interconnect Technology, Boston, MA, pp. 108‐14.

5. Kloeser, J., Heinricht, K., Kutzner, K., Jung, E., Ostmann, A. and Reichl, H. (1998), “Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology”,Proceedings of IEEE Conference, pp. 41‐50.

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