Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology-Reference-Cited by-同舟云学术

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Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Published:1998-01 Issue:1 Volume:21 Page:41-50
ISSN:1083-4400
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. C

Author:

Kloeser J.¹,Heinricht K.,Kutzner K.,Jung E.,Ostmann A.,Reichl H.

Affiliation:

1. Dept. of Reliability of Chip-Interconnection Technol. & Multichip Modules, Fraunhofer Inst. FhG/IZM, Berlin, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/3476/14622/00670027.pdf?arnumber=670027

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux;Journal of Electronic Packaging;2014-05-05

2. Statistical analysis of stencil technology for wafer-level bumping;Soldering & Surface Mount Technology;2014-04-01

3. A review of stencil printing for microelectronic packaging;Soldering & Surface Mount Technology;2012-02-03

4. A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment;Soldering & Surface Mount Technology;2008-06-27

5. Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling;Journal of Micromechanics and Microengineering;2007-08-10

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