The evolution of paste pressure during stencil printing

Author:

Clements David J.,Desmulliez Marc P.Y.,Abraham Eitan

Abstract

PurposeThe objective of this investigation is the derivation of a mathematical model that describes the pressure characteristics of paste during the stencil printing process. This model is intended to generalise a qualitative understanding of these effects using squeegees that can be curved but otherwise are standard in design.Design/methodology/approachThis is an analytical treatment of the paste behaviour from the foundations of continuity of fluid flow and shear stresses that are imparted by the squeegee blade movement.FindingsAn equation is obtained that profiles the pressure generated by the squeegee movement which, for the case of a linear squeegee, shows very good agreement with predicted pressure profiles using experimental data.Practical implicationsThis model provides a theoretical framework for a better understanding of how to overcome the failure modes inherent in stencil printing, such as over‐ or under‐filled stencil cavities.Originality/valueThis is a generalisation of a previously developed mesh printing model. It goes beyond flat squeegee designs to describe the printing process when the blade and stencil are in contact. In addition, it encompasses non‐Newtonian fluid behaviour.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Hunter, B. (1994), “A stokes flow analysis of the screen printing process”, International Journal of Microcircuits and Electronic Packaging, Vol. 17 No. 1, pp. 21‐6.

2. Kay, R.W., Stoyanov, S., Glinski, G.P., Bailey, C. and Desmulliez, M.P.Y. (2007), “Ultra‐fine pitch stencil printing for a low cost and low temperature flip‐chip assembly”, IEEE Transactions on Components and Packaging Technologies, Vol. 30 No. 1, pp. 129‐36.

3. Kay, R., Desmuliez, M.P.Y., Stoyanov, S., Bailey, C., Durairaj, R., Ekere, N., Hendriksen, M., Frimpong, F., Smith, B., Price, D., Roberts, A., Whitmore, M., Ongley, P. and Gourlay, J. (2003), “Low temperature flip‐chip packaging based on stencil printing technology”, Proceedings of the IMAPS MicroTech Conference, Ettington Chase, UK, available at: www.microstencil.com/pdf/MicrotechUK_2003.pdf.

4. Kobs, D.R. and Voigt, D.R. (1970), “Parametric dependencies in thick film screening”, Proceedings ISHM, Vol. 18, pp. 1‐10.

5. Owczarek, J.A. and Howland, F.L. (1990), “A study of the off‐contact screen printing process – part II”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 13 No. 2, pp. 368‐75.

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