Author:
Nousiainen Olli,Kangasvieri Tero,Rönkä Kari,Rautioaho Risto,Vähäkangas Jouko
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference21 articles.
1. Soldering reactions between In49Sn and Ag thick films
2. Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating
3. Fu, C‐H. and Huang, R‐F. (2000), “BGA reliability of multilayer ceramic integrated circuit (MCIC) devices”,The International Journal of Microcircuits and Electronic Packaging, Vol. 23 No. 4, pp. 393‐9.
4. Kangasvieri, T., Nousiainen, O., Putaala, J., Rautioaho, R. and Vähäkangas, J. (2006), “Reliability and RF performance of BGA solder joints with plastic‐core solder balls in LTCC/PWB assemblies”,Microelectronics Reliability, corrected proof, available online December 20, 2005in press.
5. Needes, C.R.S. and Brown, J.P. (1989), “The thermal‐cycled adhesion strength of soldered thick film silver‐bearing conductors”,Proceedings of ISHM '89, May‐June, Baltimore, MD, USA, pp. 211‐9.
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