1. Ultrathin wafer level chip size package
2. The Surface Evolver
3. Chang, S.M., Cheng, C.Y., Shen, L.C., Hwang, Y.J., Chen, Y.F., Ko, J.D., Hu, H.T., Chen, K.C., Chen, C.Y. and Chiang, K.N. (2004), “A novel WLCSP technology with high reliability, low cost and easy fabrication”,Proceedings of the 6th IEEE CPMT Electronics Packaging Technology Conference, Singapore, pp. 7‐12.
4. An overview of solder bump shape prediction algorithms with validations
5. Mechanical FEM Simulation of Bonding Process on Cu Lowk Wafers