Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste-Reference-Cited by-同舟云学术

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Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

Published:1995-02 Issue:2 Volume:7 Page:27-32
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Artaki I.,Jackson A.M.,Vianco P.T.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference12 articles.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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