Modeling of coupled heat, moisture transfer and mechanical deformations of wood during drying process-Reference-Cited by-同舟云学术

Modeling of coupled heat, moisture transfer and mechanical deformations of wood during drying process

Published:2011-10-11 Issue:7 Volume:28 Page:802-827
ISSN:0264-4401
Container-title:Engineering Computations
language:en
Short-container-title:Engineering Computations

Author:

Zhu Zhenggang,Kaliske Michael

Publisher

Emerald

Subject

Computational Theory and Mathematics,Computer Science Applications,General Engineering,Software

Reference38 articles.

1. Chen, T. and Gu, L. (2006), “Development of elastic strain and mechano‐sorptive strain during conditioning ofEucalyptus camaldulensislumber in batch kiln”,Maderas, Ciencia y tecnologia, Vol. 8, pp. 49‐56.

2. Simulation of wood deformation processes in drying and other types of environmental loading*

3. Moisture-induced stresses in spruce cross-laminates

4. Experimental and numerical determination of the hygroscopic warping of cross-laminated solid wood panels

5. Advances in the knowledge of the influence of moisture changes on the long-term mechanical performance of timber structures

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