Microstructure of solder joints with electronic components in lead‐free solders-Reference-Cited by-同舟云学术

Microstructure of solder joints with electronic components in lead‐free solders

Published:1998-04 Issue:1 Volume:10 Page:10-12
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Nakamura Yoshikazu,Sakakibara Yoshinori,Watanabe Yoshihisa,Amamoto Yoshiki

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. 1McCormack, M. and Jin, S.J. of Metals, Vol. 45, 1993, p. 33.

2. 4Suganuma, K. and Nakamura, Y.J. Jpn. Inst. Metals, Vol. 59, 1995, p. 1299.

3. 5Weiser, M.W., Kern, J.A., Drewien, C.A., Yost, F.G. and Sackinger, S.J.Intl. J.Microcircuits and Electronic Packaging, Vol. 19, 1981, p. 379.

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