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3. Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA
4. Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method
5. Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate