Local damage simulations of printed circuit boards based on in‐plane cohesive zone parameters

Abstract

PurposeThe purpose of this paper is to analyse, in a finite element simulation, the failure of a multilayer printed circuit board (PCB), exposed to an impact load, to better evaluate the reliability and lifetime. Thereby the focus was set on failures in the outermost epoxy layer.Design/methodology/approachThe fracture behaviour of the affected material was characterized. The parameters of a cohesive zone law were determined by performing a double cantilever beam test and a corresponding simulation. The cohesive zone law was used in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation.FindingsA good concurrence between the simulated and the experimentally observed failure pattern was observed. Calculating the energy release rate of two example PCBs, the significant influence of the chosen type on the local failure behaviour was proven.Originality/valueThe work presented in this paper allows for the simulation and evaluation of failure in the outermost epoxy layers of printed circuit boards due to impact loads.