Effect of Gold on the Reliability of Fine Pitch Surface Mount Solder Joints-Reference-Cited by-同舟云学术

Effect of Gold on the Reliability of Fine Pitch Surface Mount Solder Joints

Published:1992-03 Issue:4 Volume:18 Page:41-46
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Glazer J.,Kramer P.A.,Morris J.W.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference13 articles.

1. Bester, M. F. 'Metallurgical Aspects of Soldering Gold and Gold Plating,' Proceedings Internepcon, pp.211-231 (1968).

2. Foster, F. G. 'Embrittlement of Solder by Gold from Plated Surfaces,' ASTM STP 319, p.13 (1963).

3. Duckett, R. and Ackroyd, M. L. 'The Influence of Solder Composition on the Embrittlement of Soft-soldered Joints on Gold Coatings,' Electroplating & Metal Finishing, Vol.29, pp.13-20 (1976).

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