Author:
Vincent J.H.,Richards B.P.,Wallis D.R.,Gunter I.A.,Warwick M.,Steen H.A.H.,Harris P.G.,Whitmore M.A.,Billington S.R.,Harman A.C.,Knight E.
Abstract
This is the second of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the above companies and research centres. The objectives of the programme are to identify/develop lead‐free alternatives to Sn‐40Pb solder, progress towards the development of which is described in this paper. A number of promising alloys have been selected for trial in a further round of experimentation.
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
40 articles.
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