Pb-free solders: Predicting of some physicochemical properties of Ag–Cu–Sn material at different temperatures

Abstract

In this paper, the surface tension, molar volume and density of liquid Ag–Cu–Sn alloys have been calculated using Kohler, Muggianu, Toop, and Hillert models. In addition, the surface tension and viscosity of the Ag–Cu–Sn ternary alloys at different temperatures have been predicted on the basis of Guggenheim and Seetharaman–Sichen equations, respectively. The results show that density and viscosity decrease with increasing tin and increasing temperature for the all studied models. While the surface tension shows a different tendency, especially for the Kohler and Muggianu symmetric models. On the other hand, the molar volume increases with increase of temperature and tin compositions. The calculated values of surface tension and density of Ag–Cu–Sn alloys are compared with the available experimental values and a good agreement was observed.