Author:
Määttänen Jarmo,Palm Petteri,Tuominen Aulis
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Määttänen, J., Tuominen, A. and Palm, P. (1998),Reliability of (63/37) Solder Bumped Flip Chip Components on FR5 Board, 35th IMAPS Nordic Annual Conference in Stockholm, Sweden, 21‐24 September.
2. Palm, P., Tuominen, A., Määttänen, J. and Uusitalo, L. (1998),Reliability, Electrical Performance and Properties of (63/37) Solder Bumped Flip Chip Components. Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, Proceedings of SPIE, Vol. 3510, Santa Clara, 23‐24 September.
3. Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
4. Tuominen, A., Yamamori, K. and Mugishima, T. (1999b),Evaluation of Underfills, Fluxes and Solder Resists for Flip Chip Applications by Single Lap Shear Test, 3rd IEMT/IMC Symposium, Omiya, Japan, 21‐23 April.
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