Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests

Author:

Zhang Kang,Pecht Michael

Abstract

Plastic ball grid array (PBGA) packages are non‐hermetic surface mount packages, designed in response to market demands for cost‐effective, high I/O count, small footprint, and low profile components. Because of the materials and construction, PBGA packages can be vulnerable to failure mechanisms associated with exposure to temperature and humidity. In some applications, conformal coating has been used as a potential means to mitigate these problems by enhancing moisture ingress resistance. This study focused on the ability of two popular kinds of conformal coatings to protect PBGA packages from moisture‐induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking in the packages. Although it was observed that parylene coating did slow down the moisture ingress, the high temperature high humidity tests did not demonstrate that two tested conformal coatings had significant protection against moisture‐induced failures for PBGA packages.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Amagai, M. et al. (1997), “Mechanical characteristics of die attach material in ball grid array (BGA) packages”, The International Journal of Microcircuits and Electronic Packaging, Vol. 20 No. 4, pp. 482‐93.

2. Chew, S. (1996), “An investigation into moisture‐induced cracking in plastic packages using thermal analysis techniques”, Proceedings of the 22nd International Symposium for Testing and Failure Analysis, 18‐22 November, Los Angeles, CA, pp. 411‐15.

3. Cui, C.Q. (1997), “Improvement of adhesion between epoxy mold compound and solder resist in BGA packages”, Pan Pacific Microelectronics Symposium: Proceedings of the Technical Program 1997, Maui, Hawaii, pp. 241‐6.

4. Edwards, F. et al. (1999), “Effectiveness of conformal coatings as moisture barriers for PEM”, Proceedings of 1999 Military/Aerospace COTS Conference, pp. 117‐26.

5. Freeman, M. (1997), “Developing guidelines for conformal coating usage”, Circuits Assembly, Vol. 8 No. 7, pp. 56‐61.

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