Author:
Hagberg Juha,Pudas Marko,Leppävuori Seppo,Elsey Ken,Logan Alison
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Amey, D.I., Dirks, M.T., Draubt, R.R., Horowitz, S.J. and Needes, C.R.S. (2000), “Opening the doors to wireless innovations”,Advanced Packaging, Vol. 9 No. 3, March, pp. 37‐40.
2. Low cost high performance microwave structures fabricated by advanced thick film techniques
3. Ehlert, M.R. and Munoz, P.S. (1999), “Effect of processing variables on the co‐fired properties of thick film resistors in LTCC”,Proceedings of the SPIE, Vol. 3582, pp. 926‐31.
4. Method for manufacturing high-quality gravure plates for printing fine-line electrical circuits
5. Progress in thick-film pad printing technique for solar cells
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