Flip chip assemblies using gold bumps and adhesive-Reference-Cited by-同舟云学术

Flip chip assemblies using gold bumps and adhesive

Published:2001-12 Issue:3 Volume:18 Page:15-19
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Zhong Zhaowei

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. Kloeser, J., Kutzner, K. and Gross, K. (1997), “A new production line for low cost flip chip assembly”, Proceedings of the Technical Program, Surface Mount International, USA, pp. 257‐66.

2. Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

3. Zhong, Z.W., Wong, S. and Nishikawa, T. (1997), “A study of flip chip on board mounting process using anisotropic conductive films”, Proceedings of SEMICON Test, Assembly and Packaging 97, Singapore, pp. 157‐64.

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