Micro drilling quality of the Cu/BT laminate for IC substrate

Abstract

Purpose In an integrated circuit (IC) substrate, more fillers, including talcum powder and aluminium hydroxide, are added, which leads to much higher rigidity and hardness compared with a traditional printed circuit board. However, the micro drilling of IC substrates is harder. This paper aims to test the drilling process of IC substrates to improve the drilling process and the micro hole quality. Design/methodology/approach Substrate drilling by a micro drill with 0.11-mm diameter was used under several drilling conditions. The influence of drilling conditions on the drilling process was observed. Drilling forces, drill wear and micro hole quality were also studied. Findings The deformation circle around holes, hole location accuracy, bugle hole and burrs were the major defects of micro holes that were observed during the drilling of the substrate. Reducing the drilling force and drill wear was the effective way to improve hole quality. Originality/value The technology and manufacturing of IC substrates has been little investigated. Research data on drilling IC substrates is lacking. The micro hole quality directly affects the reliability of IC substrates. Thus, improving the drilling technology of IC substrates is very important.