1. Development of an ultra‐small micro drill bit for packaging substrates
2. A solution for PCB drilling with strict requirement on hole wall quality
3. Sun, J.J. (2007), “Drill bit development for back board”, Proceedings of the International PCB Technology/Information Forum, Shenzhen, China (in Chinese).
4. Wu, F.W. (2007), “Drill bit development of high density PCB of for communication application”, Proceedings of the International PCB Technology/Information Forum, Shanghai, China (in Chinese).
5. Zou, W.X. and Qu, J.G. (2004), “Drill bit development and drilling techniques for high multi‐layer back board”, Proceedings of the International PCB Technology/Information Forum, Shenzhen, China (in Chinese).