Surface oxide analysis of lead‐free solder particles-Reference-Cited by-同舟云学术

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Surface oxide analysis of lead‐free solder particles

Published:2013-02 Issue:1 Volume:25 Page:39-44
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Luo Xin,Du Wenhui,Lu Xiuzhen,Yamaguchi Toshikazu,Jackson Gavin,lei Ye Li,Liu Johan

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

2. The Oxidation of Tin

3. The Effect of Crystallographic Orientation on the Oxidation of Tin

4. The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

5. Mixed oxide films on tin

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package;Journal of Materials Science: Materials in Electronics;2019-12-04

2. Surface Characterization of Nickel-Base Superalloy Powder;Springer Proceedings in Physics;2019

3. Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuits;Soldering & Surface Mount Technology;2014-05-27

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