Author:
Skwarek Agata,Sroda Marcin,Pluska Mariusz,Czerwinski Andrzej,Ratajczak Jacek,Witek Krzysztof
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. A Tin Pest Failure
2. Transformation of Sn–Cu alloy from white tin to gray tin
3. Tin pest in Sn-0.5 wt.% Cu lead-free solder
4. Lasky, R. (2004), “Tin pest: still a forgotten concern in lead free assembly”, Proceedings of Surface Mount Technology Associated Interconnection Conference, Chicago, IL, USA, available at: www.indium.com/images/blogs/drlasky/files/TinPestPaper0723Final.pdf.
5. The influence of relaxation of stresses occurring during the β→α transformation of tin on the kinetics of the transformation
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献