Electrodeposition of metals from supercritical fluids-Reference-Cited by-同舟云学术

Electrodeposition of metals from supercritical fluids

Published:2009-08-14 Issue:35 Volume:106 Page:14768-14772
ISSN:0027-8424
Container-title:Proceedings of the National Academy of Sciences
language:en
Short-container-title:Proceedings of the National Academy of Sciences

Author:

Ke J.,Su W.,Howdle S. M.,George M. W.,Cook D.,Perdjon-Abel M.,Bartlett P. N.,Zhang W.,Cheng F.,Levason W.,Reid G.,Hyde J.,Wilson J.,Smith D. C.,Mallik K.,Sazio P.

Publisher

Proceedings of the National Academy of Sciences

Subject

Multidisciplinary

Reference23 articles.

1. Damascene copper electroplating for chip interconnections

2. Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution

3. Permeation of Carbon Dioxide through a Microporous Silica Membrane at Subcritical and Supercritical Conditions

4. Wetting Phenomena at the CO2/Water/Glass Interface

5. Application of ionic liquids to the electrodeposition of metals

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