Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference18 articles.
1. Damascene copper electroplating for chip interconnections
2. Electrodeposition of Metallic Nanowire Thin Films Using Mesoporous Silica Templates
3. Antimony Nanowire Arrays Fabricated by Pulsed Electrodeposition in Anodic Alumina Membranes
4. Synthesis and Electrochemical Properties of Single-Crystal V2O5 Nanorod Arrays by Template-Based Electrodeposition
5. Filling of TiO2 Nanotubes by Self-Doping and Electrodeposition
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