Correlative Analysis in the Semiconductor Industry

Author:

Larson DJ,Prosa TJ,Martin I,Robbes A-S,Merkulov A,Bernier N,Delaye V,van der Heide P,Dulac O,Reinhard DA,Ulfig RM

Publisher

Cambridge University Press (CUP)

Subject

Instrumentation

Reference6 articles.

1. Shallow As dose measurements of patterned wafers with secondary ion mass spectrometry and low energy electron induced x-ray emission spectroscopy

2. Critical need and future directions of SIMS depth profiling in CMOS fabrication

3. Industrial application of atom probe tomography to semiconductor devices

4. This project received funding from the Electronic Component Systems for European Leadership Joint Undertaking under agreement No 692527. It receives support from the European Union's Horizon 2020 research and innovation programme and Netherlands, Belgium, France, Hungary, Ireland, Denmark, Israel. Work done on the PlatForm for NanoCharacterisation (PFNC) was additionally supported by the “Recherches Technologiques de Base” Program of the French Ministry of Research.

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