Heat transport and temperature boundary-layer profiles in closed turbulent Rayleigh–Bénard convection with slippery conducting surfaces

Author:

Huang Maojing,Wang YinORCID,Bao Yun,He XiaozhouORCID

Abstract

We report direct numerical simulations (DNS) of the Nusselt number $Nu$ , the vertical profiles of mean temperature $\varTheta (z)$ and temperature variance $\varOmega (z)$ across the thermal boundary layer (BL) in closed turbulent Rayleigh–Bénard convection (RBC) with slippery conducting surfaces ( $z$ is the vertical distance from the bottom surface). The DNS study was conducted in three RBC samples: a three-dimensional cuboid with length $L = H$ and width $W = H/4$ ( $H$ is the sample height), and two-dimensional rectangles with aspect ratios $\varGamma \equiv L/H = 1$ and $10$ . The slip length $b$ for top and bottom plates varied from $0$ to $\infty$ . The Rayleigh numbers $Ra$ were in the range $10^{6} \leqslant Ra \leqslant 10^{10}$ and the Prandtl number $Pr$ was fixed at $4.3$ . As $b$ increases, the normalised $Nu/Nu_0$ ( $Nu_0$ is the global heat transport for $b = 0$ ) from the three samples for different $Ra$ and $\varGamma$ can be well described by the same function $Nu/Nu_0 = N_0 \tanh (b/\lambda _0) + 1$ , with $N_0 = 0.8 \pm 0.03$ . Here $\lambda _0 \equiv L/(2Nu_0)$ is the thermal boundary layer thickness for $b = 0$ . Considering the BL fluctuations for $Pr>1$ , one can derive solutions of temperature profiles $\varTheta (z)$ and $\varOmega (z)$ near the thermal BL for $b \geqslant 0$ . When $b=0$ , the solutions are equivalent to those reported by Shishkina et al. (Phys. Rev. Lett., vol. 114, 2015, 114302) and Wang et al. (Phys. Rev. Fluids, vol. 1, 2016, 082301(R)), respectively, for no-slip plates. For $b > 0$ , the derived solutions are in excellent agreement with our DNS data for slippery plates.

Funder

National Natural Science Foundation of China

Science, Technology and Innovation Commission of Shenzhen Municipality

Natural Science Foundation of Guangdong Province

Publisher

Cambridge University Press (CUP)

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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