Cleavage Dicing Mechanics in Silicon Wafers-Reference-Cited by-同舟云学术

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Cleavage Dicing Mechanics in Silicon Wafers

Published:2019-11-05 Issue:11 Volume:57 Page:689-694
ISSN:1738-8228
Container-title:Korean Journal of Metals and Materials
language:en
Short-container-title:Korean J. Met. Mater.

Author:

Lee Seong-Min,Kim Yeon-Wook

Funder

Incheon National University

Publisher

The Korean Institute of Metals and Materials

Subject

Metals and Alloys,Surfaces, Coatings and Films,Modeling and Simulation,Electronic, Optical and Magnetic Materials

Link

http://kjmm.org/upload/pdf/kjmm-2019-57-11-689.pdf

Reference11 articles.

1. An artificial neural network approach for wafer dicing saw quality prediction

2. Investigation of chipping and wear of silicon wafer dicing

3. Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage during Semiconductor Wafer Separation

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser wafer dicing process optimization using the Taguchi approach;Journal of Laser Applications;2024-08-01

2. Prevention of Tape-Induced Si₃N₄ Damage in Semiconductor Silicon Devices Encapsulated Utilizing Lead-on-Chip Packaging Technique;MATERIALS TRANSACTIONS;2021-01-01

3. Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique;Journal of Mechanical Science and Technology;2020-02

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