Sinterability and Bondability of Cu Paste Using Reductive Solvent-Reference-Cited by-同舟云学术

Sinterability and Bondability of Cu Paste Using Reductive Solvent

Published:2022-11-10 Issue:6 Volume:11 Page:278-283
ISSN:2186-702X
Container-title:Journal of Smart Processing
language:en
Short-container-title:

Author:

KOBATAKE Takanori¹,IKEDA Banri¹,ITAYA Ryo²,SUGANUMA Katsuaki³

Affiliation:

1. R&D, Business Strategy, Smart SBU, DAICEL CORPORATION

2. Sensing BU, Smart SBU, DAICEL CORPORATION

3. F3D, The Institute of Scientific and Industrial Research （ISIR）, Osaka University

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Subject

Industrial and Manufacturing Engineering,Surfaces, Coatings and Films

Link

https://www.jstage.jst.go.jp/article/jspmee/11/6/11_278/_pdf

Reference12 articles.

1. 1） K. Suganuma: “Packaging and reliability evaluation technology of the SiC/GaN power semiconductor”, THE NIKKAN KOGYO SHINBUN, LTD.（2014）, 103-107. （in Japanese）

2. 2） H. Zhang, W. Li, Y. Gao, H. Zhang, J. Jiu and K. Suganuma: “Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent” Journal of ELECTRONIC MATERIALS, 46 （2017）, 5201-5208.

3. 3） M. Nakamura, H. Tanaka, S. Yoshihara and T. Shirakashi: “In Situ Measurement of Ionic Migration of Lead-Free Solder by Quartz Crystal Microbalance” Journal of the Surface Finishing Society of Japan, 50（1999）, 1142-1146. （in Japanese）

4. 4） H. Nishikawa, T. Hirano, T. Takemoto and N. Terada: “Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste” Open Surf. Sci. J. 3 （2011）, 60-64.

5. 5） S. Krishnan, A.S.M.A. Haseeb and M.R. Johan: “Preparation and low-temperature sintering of Cu nanoparticles for high-power devices” IEEE Transactions on Components, Packaging, and Manufacturing Technology., 2 （2012）, 587-592.