Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

Published:2010-01-01 Issue:1 Volume:3 Page:60-64
ISSN:1876-5319
Container-title:The Open Surface Science Journal
language:en
Short-container-title:TOSURSJ

Author:

Nishikawa Hiroshi,Hirano Tomoaki,Takemoto Tadashi,Terada Nobuhito

Publisher

Bentham Science Publishers Ltd.

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding;Journal of Materials Research and Technology;2024-01

2. Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles;Journal of Inorganic Materials;2024

3. Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes;Transactions of The Japan Institute of Electronics Packaging;2024

4. Preparation of Ultrafine Copper Powder by Reduction of Cupric Oxide with Ascorbic Acid;2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-11-27

5. Effect of liquid metal enhanced Cu nano/micro particle paste on performance of Cu-Cu joints;Materials Today Communications;2023-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP