Method and Characteristics of Silicon Anisotropic Wet Etching Using Low Concentration Alkaline Droplets
Author:
Affiliation:
1. Department of Mechanical Engineering, Faculty of Engineering, Aichi Institute of Technology
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films
Link
https://www.jstage.jst.go.jp/article/jspmee/11/5/11_209/_pdf
Reference10 articles.
1. P. Pal, K. Sato, “Silicon wet bulk micromachining for MEMS”, Pan Stanford Pub., 2017, 79-92.
2. Y. Goto, A. Koide, “Trend of MEMS Devices and Role of Vacuum Technologies”, 56 (2013), 403-408. (in Japanese)
3. S. Kaminaga, H. Kanao, “Advent of Trillion Sensors (TSensors) and the Forthcoming Challenges”, The Journal of the Institute of Electrical Engineers of Japan, 135 (2015), 91-94. (in Japanese)
4. K. Sato, “Silicon Etching Technologies”, Journal of The Surface Finishing Society of Japan, 51 (2000), 754-759. (in Japanese)
5. H. Tanaka, S. Yamashita, Y. Abe, M. Shikida, K. Sato, “Fast etching of silicon with a smooth surface in high temperature ranges near the boiling point of KOH solution”, Sensors and Actuators A, 114 (2004), 516-520.
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