Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages-Reference-Cited by-同舟云学术

Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages

Published:2022 Issue:2 Volume:11 Page:71-77
ISSN:2186-702X
Container-title:Journal of Smart Processing
language:en
Short-container-title:

Author:

KAWASHIRO Fumiyoshi¹,YOSHIKAWA Masaaki¹,MIYAKE Eitaro¹,ENDO Yoshiki¹,TONEDACHI Tatsuo¹,NISHIKAWA Hiroshi²

Affiliation:

1. Electronic Devices & Storage Research & Development Center, Toshiba Electronic Devices & Storage Corporation

2. Joining and Welding Research Institute, Osaka University

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Subject

Industrial and Manufacturing Engineering,Surfaces, Coatings and Films

Link

https://www.jstage.jst.go.jp/article/jspmee/11/2/11_71/_pdf

Reference16 articles.

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2. P. Ning, T. G. Lei, F. Wang, G. Lu, K. D. T. Ngo, K. Rajashekara: "A Novel High-Temperature Planar Package for SiC Multichip Phase- Leg Power Module", IEEE Trans. Power Electron 25（ 2010）, 2059- 2067.

3. V. Jadhav, U Schwarzer, S. Buchholz, W. Brekel: "Novel 550A/3300V module with IGBT4 and .XT Technology in XHPTM3 package to enhance power density and lifetime for next generation power converters", Proc. PCIM Europe 2019,（ 2019）, 539-543.

4. K. S. Siow: "Are Sinterd Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?", J. Electron. Mater.43 （2014）, 947-961.

5. A. A. Bajwa, J. Wilde: "Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices, Microelectron Reliab 60（ 2016）, 115-125.

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