Quantification of Thermal Fluctuation Behavior in Chip on Wafer Process by Thermo-fluid Analysis-Reference-Cited by-同舟云学术

Quantification of Thermal Fluctuation Behavior in Chip on Wafer Process by Thermo-fluid Analysis

Published:2019 Issue:2 Volume:8 Page:65-72
ISSN:2186-702X
Container-title:Journal of Smart Processing
language:en
Short-container-title:

Author:

SAKURAI Daisuke¹²,HAMAHIRA Masaru³,SHIBATA Mai¹,NASU Hiroshi¹,FUKUMOTO Shinji²,FUJIMOTO Kozo²

Affiliation:

1. Manufacturing Technology and Engineering Division, Panasonic Corporation

2. Graduate School of Engineering, Osaka University

3. Panasonic Smart Factory Solutions Co.,Ltd.

Publisher

Sumart Processing Society for Minerals, Environment and Energy

Link

https://www.jstage.jst.go.jp/article/jspmee/8/2/8_65/_pdf

Reference13 articles.

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4. D. Hiner et al.: SLIM ™ Advanced Fan-out Packaging for High Performance Multi-die Solutions, IEEE 67th Electronic Components and Technology Conference（, 2017）575-580.

5. N. Motohashi, T. Kimura, K. Mineo, Y. Yamada, T. Nishiyama, et al.: System in wafer-level package technology with RDL-first process, Electronic Components and Technology Conference（ECTC）, 2011 IEEE 61st（, 2011）59-64.