System in wafer-level package technology with RDL-first process-Reference-Cited by-同舟云学术

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System in wafer-level package technology with RDL-first process

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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Author:

Motohashi Norikazu,Kimura Takehiro,Mineo Kazuyuki,Yamada Yusuke,Nishiyama Tomohiro,Shibuya Koujiro,Kobayashi Hiroaki,Kurita Yoichiro,Kawano Masaya

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898492.pdf?arnumber=5898492

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