High-Temperature Interaction between Carbon Fibers and Cu–Ag Eutectic Alloy
Author:
Publisher
Allerton Press
Subject
Process Chemistry and Technology,General Materials Science
Link
https://link.springer.com/content/pdf/10.3103/S1061386222040112.pdf
Reference24 articles.
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2. Geffroy, P.M. and Silvain, J.F., Structural and thermal properties of hot-pressed Cu/C matrix composites materials used for the thermal management of high-power electronic devices, Mater. Sci. Forum, 2007, vols. 534–536, pp. 1505–1508. https://doi.org/10.4028/www.scientific.net/MSF.534-536.1505
3. Barani, Z., Mohammadzadeh, A., Geremew, A., Huang, C.-Y., Coleman, D., Mangolini, L., Kargar, F., and Balandin, A.A., Thermal properties of the binary-filler hybrid composites with graphene and copper nanoparticles, Adv. Funct. Mater., 2020, vol. 30, no. 8, pp. 1–11. https://doi.org/10.1002/adfm.201904008
4. Deng, D., Jin, Y., Cheng, Y., Qi, T., and Xiao, F., Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature, ACS Appl. Mater. Interfaces, 2013, vol. 5, no. 9, pp. 3839–3846. https://doi.org/10.1021/am400480k
5. Gawande, M.B., Goswami, A., Felpin, F.X., Asefa, T., Huang, X., Silva, R., Zou, X., Zboril, R., and Varma, R.S., Cu and Cu-based nanoparticles: synthesis and applications in catalysis, Chem. Rev., 2016, vol. 116, no. 6, pp. 3722–3811. https://doi.org/10.1002/chin.201619194
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