Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate-Reference-Cited by-同舟云学术

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Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Published:2017-02-21 Issue:1 Volume:6 Page:MPC20160058
ISSN:2165-3992
Container-title:Materials Performance and Characterization
language:en
Short-container-title:Matls. Perf. Charact.

Author:

Tikale Sanjay¹,Sona Mrunali¹,Narayan Prabhu K.²

Affiliation:

1. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575 025, IN

2. Department of Metallurgical & Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575 025, IN (Corresponding author) e-mail: prabhukn_2002@yahoo.co.in

Publisher

ASTM International

Subject

Metals and Alloys,Polymers and Plastics,Mechanics of Materials,Ceramics and Composites

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of cooling rates on contact angle, joint strength and intermetallic of Sn-9Zn solder alloy;4TH INTERNATIONAL SCIENCES, TECHNOLOGY AND ENGINEERING CONFERENCE (ISTEC) 2020: Exploring Materials for the Future;2021

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