Effect of aging on properties and nanoscale precipitates of Cu-Ag-Cr alloy
Author:
Kong Lingbao1, Zhou Yanjun12, Song Kexing12, Hui David3, Hu Hao12, Guo Baojiang1, Kang Junwei1, Feng Cunli4, Cao Jun5
Affiliation:
1. College of Material Science and Engineering, Henan University of Science and Technology , Luoyang 471023 , China 2. Collaborative Innovation Center of Nonferrous Metals, Henan Province , Luoyang 471023 , China 3. University of New Orleans, Department of Mechanical Engineering , New Orleans , LA70148 , United States of America 4. Henan Senger Materials Technology Co., Ltd ., Jiaozuo 454010 , China 5. School of Mechanical Engineering, Henan Polytechnic University , Jiaozuo 454000 , China
Abstract
Abstract
In this paper, the Cu-0.52Ag-0.22Cr alloy was prepared by hot horizontal continuous casting. The effects of aging process on micro-hardness, electrical conductivity, and nanoscale precipitates of Cu-0.52Ag-0.22Cr alloy were studied. The electrical conductivity and micro-hardness increase significantly in the early aging time. With the extension of aging time, the electrical conductivity is basically unchanged and remains at a high level. While, the micro-hardness increases slowly, the change trend is different at 623 K, 723 K, and 773 K. The optimisation of process parameters occurs in 723 K for 2 h. At this time, the electric conductivity is 95.8% IACS and the hardness is 104.1 HV0.1. The XRD result shows that the Ag and Cr are precipitated in elemental form copper matrix. Further TEM shows that, Cr exists at the sub-boundary in the form of larger nanoscale precipitates (100-200 nm). While a large number of Ag nanoscale precipitates (8-10 nm) is dispersed on the copper matrix. The synergistic effect of Ag and Cr nanoscale precipitates significantly improved the properties of the alloy.
Publisher
Walter de Gruyter GmbH
Subject
Surfaces, Coatings and Films,Process Chemistry and Technology,Energy Engineering and Power Technology,Biomaterials,Medicine (miscellaneous),Biotechnology
Reference35 articles.
1. Horie H., Copper-titanium alloy for electronic component, U.S. Patent 10, 100, 387, 2018-10-16. 2. Zhang X.H., Zhang Y., Tian B.H., Jia Y.L., Liu Y., Song K.X., Volinsky A.A., Xue H.H., Cr effects on the electrical contact properties of the Al2O3-Cu/15W composites, Nanotechnol. Rev., 2019, 8(1), 128-135. 3. Yin Z.M., Zhang S.L., Hotspots and Developing Tendency on High-strength and High-conductivity Copper Alloys, Min. Metall. Eng., 2002, 2. 4. Rai M., Ingle A.P., Pandit R., Pandit R., Shende S., Gupta I., Biswas J.K., Silva S.S., Copper and copper nanoparticles: role in management of insect-pests and pathogenic microbes, Nanotechnol. Rev., 2018, 7(4), 303-315. 5. Okafuji Y., Copper-cobalt-silicon alloy for electrode material, U.S. Patent 10, 056, 166, 2018-8-21.
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
|
|