Corn starch nanocomposite films reinforced with nanocellulose

Author:

Syafiq R. M. O.1,Ilyas R. A.1234ORCID,Rajeshkumar L.56,AL-Oqla Faris M.7,Nukman Y.8,Zuhri Mohamed Yusoff Mohd19ORCID,Atiqah A.10,Thiagamani S. M. K.11,Bangar Sneh Punia12,Barile Claudia13,Sapuan S.M. 9ORCID

Affiliation:

1. Institute of Tropical Forest and Forest Products (INTROP), Universiti Putra Malaysia , 43400 UPM Serdang , Selangor , Malaysia

2. Centre for Advanced Composite Materials , Universiti Teknologi Malaysia (UTM) , Johor Bahru 81310 , Johor , Malaysia

3. Faculty of Chemical and Energy Engineering , Universiti Teknologi Malaysia , 81310 UTM , Iskandar Puteri , Johor , Malaysia

4. Centre of Excellence for Biomass Utilization , Universiti Malaysia Perlis , 02600 , Arau , Perlis , Malaysia

5. Centre for Materials and Manufacturing Technology , KPR Institute of Engineering and Technology , Coimbatore 641407 , Tamilnadu , India

6. Department of Mechanical Engineering , KPR Institute of Engineering and Technology , Coimbatore 641407 , Tamilnadu , India

7. Department of Mechanical Engineering , Faculty of Engineering, The Hashemite University , P.O. Box 330127 , Zarqa , 13133 , Jordan

8. Department of Mechanical Engineering , Faculty of Engineering, University of Malaya , 50603 Kuala Lumpur , Malaysia

9. Department of Mechanical and Manufacturing Engineering , Faculty of Engineering, Universiti Putra Malaysia , 43400 UPM Serdang , Selangor , Malaysia

10. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia , Bangi 43600 , Selangor , Malaysia

11. Department of Mechanical Engineering , Kalasalingam Academy of Research and Education , Srivilliputhur , India

12. Department of Food, Nutrition and Packaging Sciences , Clemson University , Clemson , USA

13. Department of Mechanics, Mathematics and Management , Polytechnic University of Bari , Via Orabona n.4 , Bari 70125 , Italy

Abstract

Abstract The need for flexible food packaging has increased substantially in recent years around the world due to the unprecedented growth in food consumption. Due to low cost and ease of processing, petroleum-based synthetic polymer packaging materials are being predominantly used for food packaging these days. To avoid contributing to environmental problems caused by ecological risks, consumers have been searching for alternatives to plastic food packaging due to the fact that plastics cannot be recycled and are not biodegradable. Therefore, bioplastics made from corn starch, which are biodegradable, can be one solution to these issues. The starch’s amylopectin and amylase composition has a significant impact on the polysaccharide’s characteristics. Corn starch (CS) is utilized as a food source for humans and other animals, but it also has many other applications in industry. Corn starch, on the other hand, has a few issues that need to be addressed through some modifications. Although starch-based packaging is expensive, they create less waste overall, which helps in the reduction amount of plastic pollution. A variety of natural and synthetic polymers – including polysaccharide-based materials like Kappaphycus alvarezii seaweed, collagen, alginate, chitosan, zein, cellulose, gelatin, various amino acids and polymeric materials like acrylic acid, polybutylene (PB), polyacrylic acid, polyethylene (PE), polyvinyl chloride (PVC), polyvinyl alcohol (PVA), and polycaprolactone (PCL) – are used as starch modifiers to produce polymers with a starch base that are completely biodegradable. These biopolymers have the potential to replacing petroleum-based polymers in a variety of commercial and industrial settings. Besides, corn starch nanocomposite films reinforced with nanocellulose have been investigated as a potential eco-friendly packaging material. Consequently, the effects of nanocellulose content on the mechanical, thermal, and barrier properties of corn starch-based films will be discussed in this work.

Funder

Universiti Teknologi Malaysia

Ministry of Higher Education Malaysia

Publisher

Walter de Gruyter GmbH

Subject

General Physics and Astronomy,General Materials Science,General Chemistry

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