Author:
Tapilouw Abraham Mario,Chen Liang-Chia,Xuan-Loc Nguyen,Chen Jin-Liang
Abstract
AbstractA Micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive industries. However, effective inspection systems are also needed to ensure the functional reliability of MEMS. This study developed a stroboscopic coherence scanning Interferometry (SCSI) technique for measuring key characteristics typically used as criteria in MEMS inspections. Surface profiles of MEMS both static and dynamic conditions were measured by means of coherence scanning Interferometry (CSI). Resonant frequencies of vibrating MEMS were measured by deformation of interferogram fringes for out-of-plane vibration and by image correlation for in-plane vibration. The measurement bandwidth of the developed system can be tuned up to three megahertz or higher for both in-plane and out-of-plane measurement of MEMS.
Subject
Instrumentation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
5 articles.
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