Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking
Author:
Affiliation:
1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, People’s Republic of China
2. Joining and Welding Research Institute (JWRI), Osaka University, Osaka, Japan
Funder
National Natural Science Foundation of China
Priority Academic Program Development of Jiangsu Higher Education Institutions
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/13621718.2022.2029102
Reference33 articles.
1. Mercury: The Dark-Side Temperature
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4. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
5. Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling
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