PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY PLACEMENT OF AUXILIARY GRID ELECTRODE ABOUT BALL GRID ARRAYS-Reference-Cited by-同舟云学术

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PATTERNED COPPER PLATING LAYER THICKNESS MADE UNIFORM BY PLACEMENT OF AUXILIARY GRID ELECTRODE ABOUT BALL GRID ARRAYS

Published:2006-12 Issue:12 Volume:193 Page:1503-1513
ISSN:0098-6445
Container-title:Chemical Engineering Communications
language:en
Short-container-title:Chemical Engineering Communications

Author:

Okubo Toshikazu¹,Kodera Tamie²,Kondo Kazuo³

Affiliation:

1. a Electronics Packaging Research Laboratory, Toppan Printing Co. Ltd. , Saitama , Japan

2. b Department of Applied Chemistry , Faculty of Engineering, University of Okayama , Okayama , Japan

3. c Department of Chemical Engineering , Osaka Prefecture University , Osaka , Japan

Publisher

Informa UK Limited

Subject

General Chemical Engineering,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00986440600584052

Reference6 articles.

1. Uniformity Formation of Pannel Plating by Using Convexity-Modification of Cathode Holder

2. The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition

3. The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects

4. L-Chem, L-Chem Inc. , Cleveland , OH , http://www.L-Chem.com

5. MYKA Lab. http://hp.vector.co.jp/authors/VA008899/MYKA_Lab/image-j.html

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper arrays;International Journal of Machine Tools and Manufacture;2023-04

2. Numerical Simulation of Optimizing Plating Uniformity of Interconnect Circuits on Printed Circuit Boards;Journal of Physics: Conference Series;2021-08-01

3. Study of microvia filling process based on multi-physical coupling;Transactions of the IMF;2018-02-27

4. Review—Through-Mask Electrochemical Micromachining;Journal of The Electrochemical Society;2018

5. Multi-physics coupling aid uniformity improvement in pattern plating;Circuit World;2016-05-03

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