Study of microvia filling process based on multi-physical coupling-Reference-Cited by-同舟云学术

Study of microvia filling process based on multi-physical coupling

Published:2018-02-27 Issue:2 Volume:96 Page:86-94
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Ji Linxian¹,Nie Hexian¹,Su Shidong¹,Chen Yuanming²,He Wei²,Ai Kehua³

Affiliation:

1. Department of Physics and Electronic Engineering, Yuncheng University, Yuncheng, People’s Republic of China

2. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, People’s Republic of China

3. Research and Development Department, Suining InnoQuick Electronics Limited, Suining, People’s Republic of China

Funder

Yuncheng University Research Project

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2018.1426174

Reference29 articles.

1. Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

2. Microvia fill process model and control

3. Classification of suppressor additives based on synergistic and antagonistic ensemble effects

4. Improved Uniformity of Conformal Through-Hole Copper Electrodeposition by Revision of Plating Cell Configuration

5. Periodic Pulse Reverse Cu Plating for Through-Hole Filling

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1. Structural Influence of Terminal Functional Groups on TEG-Based Leveler in Microvia Filling;Journal of The Electrochemical Society;2020-06-11

2. Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling;Transactions of the IMF;2019-07-04