Numerical Simulation of Heat Transfer in a Three-Dimensional Enclosure with Three Chips in Various Position Arrangements
Author:
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/01457630304076
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5. Experimental study of natural convection in an inclined air layer
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